Features and benefits
- Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
- Superfast switching with soft-recovery; s-factor > 1
- Low spiking and ringing for low EMI designs
- Unique “SchottkyPlus” technology; Schottky-like performance with < 1µA leakage at 25°C
- Optimised for 4.5 V gate drive
- Low parasitic inductance and resistance
- High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175°C
- Wave solderable; exposed leads for optimal visual solder inspection
Applications
- On-board DC-to-DC solutions for server and telecommunications
- Secondary-side synchronous rectification in telecommunication applications
- Voltage regulator modules (VRM)
- Point-of-Load (POL) modules
- Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
-
Brushed and brushless motor control
Parametrics
Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN2R0-30YLD | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 30 | 2 | 2.5 | 175 | 100 | 6.3 | 21.8 | 46 | 142 | 32 | 1.7 | N | 2969 | 1477 | 2013-10-02 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PSMN2R0-30YLD | PSMN2R0-30YLDX ( 9340 679 64115 ) | Active | 2D030L | ![]() LFPAK56; Power-SO8 (SOT669) | SOT669 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | Reel 7” Q1/T1 or Q2/T3 |
Quality, reliability & chemical content
Type number | Orderable part number | Chemical content | RoHS / RHF | MSL | MSL leadfree |
---|---|---|---|---|---|
PSMN2R0-30YLD | PSMN2R0-30YLDX | PSMN2R0-30YLD | ![]() ![]() | 1 | 1 |
Documentation (10)
File name | Title | Type | Date |
---|---|---|---|
PSMN2R0-30YLD | N-channel 30 V, 2.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology | Data sheet | 2018-10-30 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
PSMN2R0-30YLD | PSMN2R0-30YLD SPICE model | SPICE model | 2019-06-06 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2020-06-24 |
PSMN2R0-30YLD_RC_Thermal_Model | PSMN2R0-30YLD Thermal design model | Thermal design | 2021-01-18 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
PSMN2R0-30YLD | PSMN2R0-30YLD SPICE model | SPICE model | 2019-06-06 |
PSMN2R0-30YLD_RC_Thermal_Model | PSMN2R0-30YLD Thermal design model | Thermal design | 2021-01-18 |
Ordering, pricing & availability
Type number | Orderable part number | Ordering code (12NC) | Packing | Packing quantity | Buy online |
---|---|---|---|---|---|
PSMN2R0-30YLD | PSMN2R0-30YLDX | 934067964115 | Reel 7” Q1/T1 or Q2/T3 | - | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.